Author: Gerald Nelson
Chemical Mechanical Polish process (CMP) is the industry standard for planarizing wafers. A new process, Electrical Chemical Mechanical Polish has been developed at applied materials. CMP planiarizes wafers using down force, while ECMP uses electrical current to remove material. Due to the absence of down force many issues complicating CMP are resolved.
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Haas Electronic Materials CMP Te Rohm and Electronic Materials CMP
Technologies
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